The application of nano silicon carbide powder is difficult to form economies of scale in a short time

Silicon carbide is made into silicon carbide fiber. Silicon carbide fiber is mainly used as high-temperature resistant material and reinforcing material. High temperature resistant materials include heat shielding material, high-temperature resistant conveyor belt, filter cloth for filtering high-temperature gas or molten metal, etc. When used as reinforcement, it is often used with carbon fiber or glass fiber. It is mainly reinforced metal (such as aluminum) and ceramics, such as brake pads, engine blades, landing gearbox and fuselage structural materials of jet aircraft. It can also be used as sporting goods, and its chopped fiber can be used as high-temperature furnace materials.

Silicon carbide manufacturers have been able to supply a large amount of silicon carbide coarse materials, but the application of nano silicon carbide powder with high technical content is unlikely to form economies of scale in a short time. The research and development of silicon carbide wafer in China is still in its infancy, the application of silicon carbide wafer in China is less, and the development of silicon carbide material industry lacks the support of downstream application enterprises. Carry out close cooperation on talent training and technology R & D; Strengthen exchanges among enterprises, especially actively participate in international exchange activities to improve the development level of enterprises; Pay attention to the enterprise brand construction and strive to build the enterprise's fist products.

Silicon carbide refractory board is widely used in high-grade sanitary ware, daily ceramics and electric porcelain kilns. The products have the advantages of high temperature resistance, thermal shock resistance, oxidation resistance and high strength. The products have uniform thickness, smooth surface and no slag during use. They can be processed into products of various sizes and specifications according to customer product requirements

Product features:

Small thermal expansion coefficient, good thermal shock stability, long service life and no sudden fracture

No oxidation, dirt and slag fall during use, and no pollution to ceramic products

Cordierite products can meet various firing needs of ceramics and magnetic materials below 1250 ℃

The storage place must be kept dry and away from moisture. The storage method should avoid plane stacking. It should be arranged vertically and neatly. When building fire-resistant plates, the fire-resistant columns should be vertical to the fire-resistant plates, and the multi-layer fire-resistant columns should be in a straight line. The design of firing curve should meet the conditions of normal operation. Slow cooling should be used during cooling to avoid rapid cooling by cold air. Handle carefully when going down the kiln, Avoid handling by hand at high temperatures

Due to its micro morphology and crystal structure, silicon carbide one-dimensional nano materials have more unique excellent properties and wider application prospects. It is generally considered to be an important component of the third generation broadband gap semiconductor materials.

The third generation semiconductor materials, namely wide band gap semiconductor materials, also known as high temperature semiconductor materials, mainly include silicon carbide, gallium nitride, aluminum nitride, zinc oxide, diamond, etc. These materials have the characteristics of wide band gap (band gap width greater than 2.2ev), high thermal conductivity, high breakdown electric field, high radiation resistance and high electron saturation rate. They are suitable for the fabrication of high temperature, high frequency, radiation resistance and high-power devices. The third generation semiconductor materials have broad application prospects in the future because of their excellent properties.